Copper C10100

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Annealing Procedure

The annealing temperature for this alloy is between 700 and 1200 F.

Applications

Used for electrical and electronic conductors, wave guides, cavity resonators, superconductor matrixes, vacuum tube and solid-state devices, and glass-to-metal seals.

Cold Workability

The capacity for cold working this alloy is rated as "excellent".

Forgeability

The hot forgeability rating of this alloy is 65. (Forging brass = 100). The recommended hot working temperature for this alloy is between 1400 and 1600 F.

Hot Workability

This alloy's capacity for being hot formed is rated as "excellent".

Machinability

The machinability rating of this alloy is 20. (Where Alloy 360 FC Brass is 100).

Principle Design Features

Copper, OFE, Oxygen Free Electronic. C10100 has conductivity 101% IACS, the highest among coppers.

Weldability

Soldering is rated as "excellent", brazing is rated as "excellent", oxyacetylene welding is rated as "fair", gas shielded arc welding is rated as "good", coated metal arc welding is "not recommended", spot welding is "not recommended", seam welding is "not recommended" and butt welding is rated as "fair"

Known Forms

Bus Bar

Bus Bar

Coil

Coil

Disc

Disc

Flat Bar

Flat Bar

Foil

Foil

Hollow Bar

Hollow Bar

Pipe

Pipe

Plate

Plate

Ring

Ring

Rod

Rod

Round Bar

Round Bar

Round Tube

Round Tube

Sheet

Sheet

Square Bar

Square Bar

Strip

Strip

Additional Data

Specifications

4700,B1,B111,B133,B152,B172,B173,B174,B187,B188,B189,B2,B224,B246,B272,B280,B286,B298,B3,B33,B355,B359,B432,B447,B451,B470,B48,B49,B496,B640,B641,B698,B75,F68,B-18907,W-3318,W-85,B575,B650,W343,C10100

Chemical Elements

Copper99.99 nom
Phosphorus0.0003 max
Remainder Total0.004 max
Tellurium0.001 max

Physical Properties

Density: 0.323lb/in³Density

Electrical Resistivity: 10.3µΩ·cmElectrical Resistivity

Melting Point: 1981°FMelting Point

Mechanical Properties

Modulus of Elasticity – Tension: 17MSIModulus of Elasticity – Tension

Thermal Conductivity: 18.8333BTU/hr·ft·°FThermal Conductivity

Thermal Expansion: 9.4µin/in·°FThermal Expansion

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