Refractory
Refractory Tungsten
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Because of its high melting temperature, tungsten is commonly employed in a variety of lighting and furnace applications. Additionally, the coefficient of thermal expansion of tungsten is close to that of silicon, making it a good selection in brazed mounts for silicon diode chips.
Formability
Tungsten can be quite difficult to form in any fashion. It is necessary to preheat the material to a minimum of 675 C prior to any forming.
Principle Design Features
Tungsten has good thermal and electrical conductivity along with low vapor pressure at high temperature. As an element, trungsten has the highest melting temperature of all metallic materials (6170 F). Due to this fact, conventional melting methods are impractical and the material is pressed and sintered into shapes for re-working. Additional data available at http://www.rembar.com/tung.htm.
Known Forms
Billet
Disc
Foil
Ingot
Plate
Powder
Ribbon
Ring
Rod
Sheet
Specialty Form
Wire Flat
Wire Round
Additional Data
Physical Properties
Density: 0.697lb/in³
Electrical Resistivity: 34µΩ·cm
Melting Point: 6170°F
Mechanical Properties
Thermal Conductivity: 8.5833BTU/hr·ft·°F
Thermal Expansion: 2.5µin/in·°F